Capacity for state-of-the-art a method of construction matching function realization of high-accuracy product detect capacity materialization of high speed
Know- How of automatic skill (during 14 years)
XSCAN-3080 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach.
Experience a life of efficiency make product by equipment suitable for advance a method of construction.
Feature
Major Features :
PCB / BGA inspection
- Focus Size : 33μm, 80kv
- Max PCB Size : 350 x 300mm
Geometric magnification
- Geometric Enlargement ratio : 20x
- Enlargement on monitor : 300x
Automatic position teaching and replying
Mediocrity
- Easy inspection by manal manipulator
Pseudo 3D image display
Simple maintenance
- Sealed type's x-ray tube
High Resolution (option)
- Noise clearing capacity
- Pseudo Coloring, 3D Image
Easy to use
- Easy to use by mouse
Inspection for BGA, PCB, MLB
- Easy input and inspect BGA input Bed
- void, short, excessive solder, insufficient solder inspect capacity
User-friendly and easy to use